JPH0395664U - - Google Patents
Info
- Publication number
- JPH0395664U JPH0395664U JP204290U JP204290U JPH0395664U JP H0395664 U JPH0395664 U JP H0395664U JP 204290 U JP204290 U JP 204290U JP 204290 U JP204290 U JP 204290U JP H0395664 U JPH0395664 U JP H0395664U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- external lead
- large number
- reinforcing
- insulating container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990002042U JP2508516Y2 (ja) | 1990-01-11 | 1990-01-11 | 集積回路用パッケ―ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990002042U JP2508516Y2 (ja) | 1990-01-11 | 1990-01-11 | 集積回路用パッケ―ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0395664U true JPH0395664U (en]) | 1991-09-30 |
JP2508516Y2 JP2508516Y2 (ja) | 1996-08-28 |
Family
ID=31505923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990002042U Expired - Fee Related JP2508516Y2 (ja) | 1990-01-11 | 1990-01-11 | 集積回路用パッケ―ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2508516Y2 (en]) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5728347A (en) * | 1980-07-28 | 1982-02-16 | Fujitsu Ltd | Lead frame |
JPS63204751A (ja) * | 1987-02-20 | 1988-08-24 | Toshiba Corp | リ−ドフレ−ムおよびこれを用いた半導体装置並びにこの半導体装置の製造方法 |
JPS6455851A (en) * | 1987-07-22 | 1989-03-02 | Control Data Corp | Insulating tie-bar device for avoiding misalignment of lead wires of semiconductor chip |
JPH01175759A (ja) * | 1987-12-29 | 1989-07-12 | Hitachi Ltd | 半導体装置の製造方法 |
-
1990
- 1990-01-11 JP JP1990002042U patent/JP2508516Y2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5728347A (en) * | 1980-07-28 | 1982-02-16 | Fujitsu Ltd | Lead frame |
JPS63204751A (ja) * | 1987-02-20 | 1988-08-24 | Toshiba Corp | リ−ドフレ−ムおよびこれを用いた半導体装置並びにこの半導体装置の製造方法 |
JPS6455851A (en) * | 1987-07-22 | 1989-03-02 | Control Data Corp | Insulating tie-bar device for avoiding misalignment of lead wires of semiconductor chip |
JPH01175759A (ja) * | 1987-12-29 | 1989-07-12 | Hitachi Ltd | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2508516Y2 (ja) | 1996-08-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |