JPH0395664U - - Google Patents

Info

Publication number
JPH0395664U
JPH0395664U JP204290U JP204290U JPH0395664U JP H0395664 U JPH0395664 U JP H0395664U JP 204290 U JP204290 U JP 204290U JP 204290 U JP204290 U JP 204290U JP H0395664 U JPH0395664 U JP H0395664U
Authority
JP
Japan
Prior art keywords
integrated circuit
external lead
large number
reinforcing
insulating container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP204290U
Other languages
English (en)
Japanese (ja)
Other versions
JP2508516Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990002042U priority Critical patent/JP2508516Y2/ja
Publication of JPH0395664U publication Critical patent/JPH0395664U/ja
Application granted granted Critical
Publication of JP2508516Y2 publication Critical patent/JP2508516Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1990002042U 1990-01-11 1990-01-11 集積回路用パッケ―ジ Expired - Fee Related JP2508516Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990002042U JP2508516Y2 (ja) 1990-01-11 1990-01-11 集積回路用パッケ―ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990002042U JP2508516Y2 (ja) 1990-01-11 1990-01-11 集積回路用パッケ―ジ

Publications (2)

Publication Number Publication Date
JPH0395664U true JPH0395664U (en]) 1991-09-30
JP2508516Y2 JP2508516Y2 (ja) 1996-08-28

Family

ID=31505923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990002042U Expired - Fee Related JP2508516Y2 (ja) 1990-01-11 1990-01-11 集積回路用パッケ―ジ

Country Status (1)

Country Link
JP (1) JP2508516Y2 (en])

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5728347A (en) * 1980-07-28 1982-02-16 Fujitsu Ltd Lead frame
JPS63204751A (ja) * 1987-02-20 1988-08-24 Toshiba Corp リ−ドフレ−ムおよびこれを用いた半導体装置並びにこの半導体装置の製造方法
JPS6455851A (en) * 1987-07-22 1989-03-02 Control Data Corp Insulating tie-bar device for avoiding misalignment of lead wires of semiconductor chip
JPH01175759A (ja) * 1987-12-29 1989-07-12 Hitachi Ltd 半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5728347A (en) * 1980-07-28 1982-02-16 Fujitsu Ltd Lead frame
JPS63204751A (ja) * 1987-02-20 1988-08-24 Toshiba Corp リ−ドフレ−ムおよびこれを用いた半導体装置並びにこの半導体装置の製造方法
JPS6455851A (en) * 1987-07-22 1989-03-02 Control Data Corp Insulating tie-bar device for avoiding misalignment of lead wires of semiconductor chip
JPH01175759A (ja) * 1987-12-29 1989-07-12 Hitachi Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JP2508516Y2 (ja) 1996-08-28

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees